全自動(dòng)晶圓切膜機(jī)（真空）STK-7200V特點(diǎn)：無滾輪的特殊真空安裝技術(shù)(滾輪安裝可選)配置進(jìn)口多軸晶圓搬運(yùn)機(jī)械手臂可以應(yīng)對(duì)更薄的晶圓進(jìn)行切割膜的貼膜晶圓位置和翹曲智能反饋17英寸觸摸屏液晶工業(yè)電腦控制貼膜動(dòng)作：全自動(dòng)拉膜和貼膜

詳細(xì)介紹

全自動(dòng)晶圓切膜機(jī)（真空）STK-7200V特點(diǎn)：

無滾輪的特殊真空安裝技術(shù)(滾輪安裝可選)

配置進(jìn)口多軸晶圓搬運(yùn)機(jī)械手臂

可以應(yīng)對(duì)更薄的晶圓進(jìn)行切割膜的貼膜

晶圓位置和翹曲智能反饋

17英寸觸摸屏液晶工業(yè)電腦控制

貼膜動(dòng)作：全自動(dòng)拉膜和貼膜，收廢膜

如需詳細(xì)參數(shù) 歡迎您聯(lián)系我們

STK-7200V Fully Automatic Wafer Vacuum Mounter Specifications：

Wafer Size	Diameter:4", 5", 6" & 8"
Wafer Thickness	80 ~ 750 um
Wafer material	Si, SiC
Wafer Type	Single Flat, Double Flat or V-Notch
Tape Type	Blue Tape or UV Tape Width :230、300 mm, Length:100 m; Thickness: 0.05 ~ 0.2 mm
Frame Type	6" DISCO or K&S, 8" DISCO or K&S; or Customer Specified
Mounting Theory	Vacuum Mounting
Wafer Place Accuracy	X-Y: +/- 0. 1 mm Θ: +/- 0.1°
Input & Output	Dual Input Wafer Cassette / Single Output Frame Cassette
ESD Control	ESD Roller / ESD Wafer Chuck / ESD Ion Blower
Wafer Transfer	Horizontal Multi Axis Robot with Vacuum or Bernoulli Endeffector Wafer Position & Warpage Intelligent Mapping in Cassette
Wafer Alignment	Fiber Sensor for Wafer Alignment
Control Unit	Standard Industrial PC with 17" Touch Panel LCD / Windows O/S
Power Supplier	Single Phase AC 220 V, 25A
Air Supplier	5.0 Kgf/cm2 CDA, 150 L/min
Machine Construction	Made of Full Aluminium Profile
Dimensions	1750 mm (W) × 1350 mm (D) × 1800 mm (H)
Net Weight	870 Kg