激情综合啪啪6月丁香,久久久久国产精品91福利,99精品日韩欧美在线观看,91成人午夜福利在线观看国产

行業(yè)產(chǎn)品

  • 行業(yè)產(chǎn)品

上海衡鵬企業(yè)發(fā)展有限公司


當(dāng)前位置：上海衡鵬企業(yè)發(fā)展有限公司>>半導(dǎo)體>>OKAMOTO GDM300晶圓研磨

OKAMOTO GDM300晶圓研磨

返回列表頁
參  考  價面議
具體成交價以合同協(xié)議為準(zhǔn)

產(chǎn)品型號

品       牌

廠商性質(zhì)其他

所  在  地上海

聯(lián)系方式：查看聯(lián)系方式

更新時間：2024-06-12 09:22:27瀏覽次數(shù)：219次

聯(lián)系我時，請告知來自 環(huán)保在線

經(jīng)營模式：其他

商鋪產(chǎn)品：635條

所在地區(qū)：

產(chǎn)品簡介

OKAMOTOGDM300晶圓拋光/晶圓背拋概要：ModelGDM300grinderisafullyautomaticcontinuousdownfeedgrindingmachinewithdualpolishingstationsforincreasedthroughput

詳細介紹

OKAMOTO GDM300晶圓拋光/晶圓背拋概要：

Model GDM300 grinder is a fully automatic continuous downfeed grinding machine with dual polishing stations for increased throughput. Wafers are handled through the machine by a 6-axis robot, and load/unload arms designed for 25 um capability. An optional edge trimming system is recommended for eliminating edge chipping for thin wafers. Chuck speed, grinding wheel, and grind spindle downfeed rate speeds can be used to manipulate grinder throughput, surface finish, and wheel life. A two-point in-process gauge measuring system controls wafer thickness under grind spindles 1 and 2 with an optional laser detection for a more precision thickness accuracy (recommended for < 50 um). Programmable oscillating polish heads can be programmed to maintain wafer profile (ttv) in conjunction with with the optional motorized spindle angle adjustment. After completion at grind and polish, wafer is automatically transferred by robot to the mounter unit for UV exposure, detape, and mount. Pre-cut DAF feature is optional while single DAF is included. Coin-stack feature may be integrated. The local polishing unit removes subsurface damage for increased wafer die strength and the ability to handle final thickness of 25 microns.



OKAMOTO GDM300晶圓拋光/晶圓背拋特點： 

The process from back grinding to wafer mounting continuously by fully automatic system, 

Which enable to grind till 25um thickness.

With 2 head polishing stage, throughput is almost double compared with 1 polish head system.

Built in edge trimming system is available as an option for thin wafer process.

Dual index system, which polishing stage and grinding stage is completely separated, 

satisfy the cleanness required for TSV and MEMS process.

Less than Ra1? ultra luminance, ultra mirror surface is possible.



OKAMOTO GDM300晶圓拋光/晶圓背拋規(guī)格參數(shù)：

Maximum wafer-

machining diameter of wafer

12"

Grinding Spindle: Bearing type 

                            Motor 

                            Rapid feed speed

                            Grind feed speed

Air bearing, maximum 3000 rpm

5.5 kw, 4P, high frequency motor 

240 mm/min

1 to 999 µm/min

Grinding wheel size

?300 mm

Index Table: Number of work spindles 

                    Work spindle Bearing type 

                    Speed of Work Spindles             

3

Air Bearing

1 to 300 rpm

Automatic Sizing Device:

      Wafer thickness measuring system 

      Wafer minimum setting size resolution

      Wafer size display range

2 point contact in-process gauge,Laser Detection (Opt.)

0.1 µm 

0to 1.6 mm; extended range software available

Table Cleaning Device (Grinder side)

DI Water + Ceramic block

Wafer Cleaning Unit (Grinder side)

DI Water + Brush

Edge Trimming Device (Optional): 

                Max Spindle Speed

                Accuracy

Recommended for < 50 um.

1800 rpm 

+/- 5 µm

Number of Cassettes

2 cassette stations

Polish Station: Work Spindle

                       Polish head

                       Oscillation speed

                       Head Load

                       Pad size

2High Precision Ball Bearing Work Spindles on Index Table 

3Kw AC servo motor for 10 – 320 rpm

100 – 9,000 mm/min.

0 – 0.5 Kg/cm2

240mm for 300mm, 160mm for 200mm

Polish table speed

Vacuum Chuck material

3 Kw AC servo motor for 550 rpm max 

Alumina ceramics + porous ceramics

Integrated Mounter System:

                      Robot 

                      Vacuum Chuck 

                      Handling pads 

                      UV Irradiating 

                      Single DAF/Pre-Cut DAF 

                      Coin-Stack


6-Axis Mitsubishi Robot 

Porous Carbon Fiber Vacuum Chucks 

Carbon Fiber Handling Pads 

Standard UV Irradiation system 

Single DAF included/Pre-Cut DAF Optional 

Coin-Stack Included



您感興趣的產(chǎn)品PRODUCTS YOU ARE INTERESTED IN

環(huán)保在線 設(shè)計制作，未經(jīng)允許翻錄必究 .? ? ? Copyright(C)?2021 http://www.hg1112.cn,All rights reserved.

以上信息由企業(yè)自行提供，信息內(nèi)容的真實性、準(zhǔn)確性和合法性由相關(guān)企業(yè)負責(zé)，環(huán)保在線對此不承擔(dān)任何保證責(zé)任。 溫馨提示：為規(guī)避購買風(fēng)險，建議您在購買產(chǎn)品前務(wù)必確認供應(yīng)商資質(zhì)及產(chǎn)品質(zhì)量。

會員登錄

×

請輸入賬號

請輸入密碼

=

請輸驗證碼

收藏該商鋪

請 登錄 后再收藏

提示

您的留言已提交成功！我們將在第一時間回復(fù)您~
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | |