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OKAMOTO GDM300晶圓研磨

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OKAMOTOGDM300晶圓拋光/晶圓背拋概要：ModelGDM300grinderisafullyautomaticcontinuousdownfeedgrindingmachinewithdualpolishingstationsforincreasedthroughput

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OKAMOTO GDM300晶圓拋光/晶圓背拋概要：

Model GDM300 grinder is a fully automatic continuous downfeed grinding machine with dual polishing stations for increased throughput. Wafers are handled through the machine by a 6-axis robot, and load/unload arms designed for 25 um capability. An optional edge trimming system is recommended for eliminating edge chipping for thin wafers. Chuck speed, grinding wheel, and grind spindle downfeed rate speeds can be used to manipulate grinder throughput, surface finish, and wheel life. A two-point in-process gauge measuring system controls wafer thickness under grind spindles 1 and 2 with an optional laser detection for a more precision thickness accuracy (recommended for < 50 um). Programmable oscillating polish heads can be programmed to maintain wafer profile (ttv) in conjunction with with the optional motorized spindle angle adjustment. After completion at grind and polish, wafer is automatically transferred by robot to the mounter unit for UV exposure, detape, and mount. Pre-cut DAF feature is optional while single DAF is included. Coin-stack feature may be integrated. The local polishing unit removes subsurface damage for increased wafer die strength and the ability to handle final thickness of 25 microns.

OKAMOTO GDM300晶圓拋光/晶圓背拋特點(diǎn)：

The process from back grinding to wafer mounting continuously by fully automatic system,

Which enable to grind till 25um thickness.

With 2 head polishing stage, throughput is almost double compared with 1 polish head system.

Built in edge trimming system is available as an option for thin wafer process.

Dual index system, which polishing stage and grinding stage is completely separated,

satisfy the cleanness required for TSV and MEMS process.

Less than Ra1? ultra luminance, ultra mirror surface is possible.

OKAMOTO GDM300晶圓拋光/晶圓背拋規(guī)格參數(shù)：

Maximum wafer-

machining diameter of wafer

12"

Grinding Spindle: Bearing type

Motor

Rapid feed speed

Grind feed speed

Air bearing, maximum 3000 rpm

5.5 kw, 4P, high frequency motor

240 mm/min

1 to 999 µm/min

Grinding wheel size

?300 mm

Index Table: Number of work spindles

Work spindle Bearing type

Speed of Work Spindles

Air Bearing

1 to 300 rpm

Automatic Sizing Device:

Wafer thickness measuring system

Wafer minimum setting size resolution

Wafer size display range

2 point contact in-process gauge,Laser Detection (Opt.)

0.1 µm

0to 1.6 mm; extended range software available

Table Cleaning Device (Grinder side)

DI Water + Ceramic block

Wafer Cleaning Unit (Grinder side)

DI Water + Brush

Edge Trimming Device (Optional):

Max Spindle Speed

Accuracy

Recommended for < 50 um.

1800 rpm

+/- 5 µm

Number of Cassettes

2 cassette stations

Polish Station: Work Spindle

Polish head

Oscillation speed

Head Load

Pad size

2High Precision Ball Bearing Work Spindles on Index Table

3Kw AC servo motor for 10 – 320 rpm

100 – 9,000 mm/min.

0 – 0.5 Kg/cm2

240mm for 300mm, 160mm for 200mm

Polish table speed

Vacuum Chuck material

3 Kw AC servo motor for 550 rpm max

Alumina ceramics + porous ceramics

Integrated Mounter System:

Robot

Vacuum Chuck

Handling pads

UV Irradiating

Single DAF/Pre-Cut DAF

Coin-Stack

6-Axis Mitsubishi Robot

Porous Carbon Fiber Vacuum Chucks

Carbon Fiber Handling Pads

Standard UV Irradiation system

Single DAF included/Pre-Cut DAF Optional

Coin-Stack Included

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