透射式可飽和吸收體SA適用波長(zhǎng)范圍為980-3000nm,尺寸從1.0 x 1.0~5.0 x 5.0mm,搭配多種不同的封裝基底。BATOP可飽和吸收體主要分為2個(gè)系列,透射式可飽和吸收體SA和共振可飽和吸收體RSA,都是應(yīng)用于透射的方式產(chǎn)生鎖模激光,相對(duì)于可飽和吸收鏡利用布拉格反射鏡的工作方法,它們的特點(diǎn)是透射式,成本相對(duì)較低,而且可飽和吸收體SA的能量密度遠(yuǎn)高于SESAM。
詳細(xì)介紹
可飽和吸收體SA的適用波長(zhǎng)范圍從980nm到3000nm,弛豫時(shí)間從500fs~37ps,其尺寸從1.0 mm x 1.0 mm至5.0 mm x 5.0 mm,搭配多種封裝基底。德國(guó)BATOP提供用于兩款透射式的可飽和吸收體,包括透過(guò)應(yīng)用的SA可飽和吸收體和用于共振器件的透射型共振可飽和吸收體,它們能夠相對(duì)低成本地實(shí)現(xiàn)激光鎖模,應(yīng)用于環(huán)形激光器。
? Batch of 4 unmounted chips ? Chip area 1.3 mm x 1.3 mm 或 1.0 mm x 1.0 mm ? Chip thickness 100 µm, for fiber laser butt coupling,
€ 624
x = 5.0-12.7g-c / 5.0-12.7g
? Chip area 5.0 mm x 5.0 mm ? Chip thickness 625 µm, both sides AR coated ? Glued on a copper heat sink with 12.7 mm diameter and 4 mm hole ? Center mounted (standard): x = 5.0-12.7g-c ? Edge mounted : x = 5.0-12.7g-e
€ 702
x = 5.0-25.0g-c / 5.0-25.0g
? Chip area 5.0 mm x 5.0 mm ? Chip thickness 625 µm, both sides AR coated ? Glued on a copper heat sink with 25.0 mm diameter and 4 mm hole ? Center mounted (standard): x = 5.0-25.0g-c ? Edge mounted : x = 5.0-25.0g-e
€ 702
x = 5.0-25.4g-c / 5.0-25.4g
? Chip area 5.0 mm x 5.0 mm ? Chip thickness 625 µm, both sides AR coated ? Glued on a copper heat sink with 25.4 mm diameter and 4 mm hole ? Center mounted (standard): x = 5.0-25.4g-c ? Edge mounted : x = 5.0-25.4g-e
€ 702
x = FC/PC / FC/APC
? Mounted inside a 1 m long single mode fiber. ? Available fibers: HI 980, HI 1060, Panda SM98-PS-U25A ? FC/PC connector: x = FC/PC ? FC/APC connector: x = FC/APC
? Batch of 4 unmounted chips ? Chip area 1.3 mm x 1.3 mm 或 1.0 mm x 1.0 mm ? Chip thickness 100 µm, for fiber laser butt coupling,
€ 624
x = 5.0-12.7g
? Chip area 5.0 mm x 5.0 mm ? Chip thickness 625 µm, both sides AR coated ? Glued on a copper heat sink with 12.7 mm diameter and 4 mm hole ? Center mounted (standard): x = 5.0-12.7g-c ? Edge mounted : x = 5.0-12.7g-e
€ 702
x = 5.0-25.0g
? Chip area 5.0 mm x 5.0 mm ? Chip thickness 625 µm, both sides AR coated ? Glued on a copper heat sink with 25.0 mm diameter and 4 mm hole ? Center mounted (standard): x = 5.0-25.0g-c ? Edge mounted : x = 5.0-25.0g-e
€ 702
x = 5.0-25.4g
? Chip area 5.0 mm x 5.0 mm ? Chip thickness 625 µm, both sides AR coated ? Glued on a copper heat sink with 25.4 mm diameter and 4 mm hole ? Center mounted (standard): x = 5.0-25.4g-c ? Edge mounted : x = 5.0-25.4g-e