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聯(lián)系我時(shí)，請(qǐng)告知來(lái)自 環(huán)保在線FlipChipBonder特點(diǎn)：Chip-to-WaferFlipchipbonderforNCF-TCBprocessCapableofhigh-speed
Flip Chip Bonder特點(diǎn)： |
Chip-to-Wafer Flip chip bonder for NCF-TCB process |
Capable of high-speed, high-precision flip chip bonding by adopting probe camera technology and linear motor |
High precision control of both bond head force and Z position |
Shinkawa’s NRS technology reduced vibration that obstructs fine pitch bonding |
High throughput achieved by short heating and cooling with pulse heater |
Automatic product-type changeover function with capability to bond up to 4 different product-type chips enables handling of 2.5D and 3D stack packaging |
Capable of handling each plunge-up method and thin die pickup |
Capable of handling 12-inch chip wafer and base wafer |
Molten solder detection function and high-precision Z control reduce damage on devices (under low force mode) |
Process monitoring and management function securing stable quality and process portability |
Flip Chip Bonder規(guī)格參數(shù)： |
Product Name | Flip Chip Bonder |
Model | LFB-2301 |
Bonding Method | Pulse heat thermocompression |
Bonding Accuracy | ±2μm (3σ) by Shinkawa’s standard condition |
Bonding Force | 1 - 300N ※Capable of selecting bond force control method at bonding process However, it is not capable of switching over between low force control and high force control in the identical bond profile ?Low force Control mode：1 - 50N in 0.1N increments ?High force Control mode：10 - 300N in 1N increments |
Bonding Tool Setting Temperature | RT - 400℃ (in 1℃ increments pulse heat） |
Bonding Stage Setting Temperature | RT - 150℃ (in 1℃ increments pulse heat） |
Chip Size | □2 - 20mm t＝0.05-0.7mm |
Chip Wafer Size | φ200mm, φ300mm |
Base Wafer Size | φ200mm, φ300mm |
| Process | NCF-TCB：Option available：NCP-TCB, Flux-TCB |
| Option Available | Communication Interface SECS Ⅰ/ SECS Ⅱ, HSMS, GEM |
| Utilities | Electricity：Three-phase AC 200V±5％ 50/60Hz (if other voltage, consults us) |
Power Consumption：5.0kW Maximum | |
CDA：570kPa (5.7kgf/cm２) 250L/min Connection：φ10 Tube 1spot | |
Vacuum：Below -74kPa (-550mmHg) (gage) Connection：φ10 Tube 3spots | |
Physical Dimensions and Mass | Approx. 3,292W×1,521D×1,701H mm Approx 3,000kg (excludes monitor display, signal tower and load port) |
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