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貼片/裝片 Die Attach

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產(chǎn)品簡介

貼片/裝片 Die Attach

詳細介紹

Die Attach特點：

High-accuracy bonding by unique 3D-NRS technology

High-productivity and space-saving footprint by adopting twin-head

High-speed thin die pick-up system with a speed of 400ms / t:20um(option)

*Depending on material conditions

Friction-free bonding head with simultaneous positional and force control for thin die stacked devices

Cleanness control with HEPA-filter and stainless steel full cover

Equipped with die back-side camera on each bonding head,

enhancing inspection function with a total of 8 cameras

Capable of handling large substrates up to 120mm width x 300mm length

Die Attach規(guī)格參數(shù)：

Product Name	Die Bonder
Model	SPA-1000
Bonding Method	DAF bonding
Accuracy	XY：±5μm (3σ)、θ：±0.05°(3σ) (Machine accuracy excluding material-induced factors)
Productivity	The productivity increased by 2.5 times compared with conventional model. (Theoretical value with Shinkawa's standard sample)
Chip Size	□0.8 – 25mm
Wafer Size	Maximum 12-inch
Substrate/Leadframe Size	Width 40 – 120mm Length 180 – 300mm Thickness0.05 – 0.8mm
Options Available	Thin die application kit, Film attachment unit, capability to handle overhead transport (OHT)
Utilities	Input Power Supply：Single Phase AC200V±5%　50/60Hz (Other power supply options available on request)
	Power：Maximum 3.2 kVA (3.2kW)
	Consumption
	Air：500kPa (5kgf/cm2) 900 L/min
	Vacuum：Below -74kPa (-550mmHg) (gage)
Physical Dimensions and Mass	Approx. 2,280W × 1,510D × 1,670H mm　Approx. 2,300 kg (excludes monitor display and signal tower)